Photon Bridge
Multi-wavelength digital light engines for DWDM optical interconnects in AI data centers and high-performance computing.
Website: https://www.photonbridge.com/
Cover Block
Publicly reported
| Field | Value |
|---|---|
| Name | Photon Bridge |
| Tagline | Multi-wavelength digital light engines for DWDM optical interconnects in AI data centers and high-performance computing [Photon Bridge, retrieved 2026] |
| Headquarters | Eindhoven, Netherlands [Photon Bridge, retrieved 2026] |
| Founded | 2020 [Bits&Chips, Sep 2025] |
| Stage | Seed [Photon Bridge, Jan 2025] |
| Business model | Hardware + Software |
| Industry | Deeptech |
| Technology type | Hardware |
| Geography | Western Europe |
| Growth profile | Venture Scale |
| Founding team | Co-Founders (2) [Bits&Chips, Sep 2025] |
| Funding label | Seed |
| Total disclosed | €4.75 million [Photon Bridge, Jan 2025] |
Links
Publicly reported
- Website: https://www.photonbridge.com/
Summary and Signal
PUBLIC Photon Bridge is building multi-wavelength digital light engines for DWDM optical interconnects, a part of the photonics stack that matters more as AI data centers and high-performance computing systems demand higher bandwidth and tighter power budgets [Photon Bridge, retrieved 2026] [Semiconductor Today, Feb 2026]. Founded in Eindhoven in 2020, the company appears to have spent its early years on platform development before rebranding from Photon IP to Photon Bridge in 2025 and pairing that identity shift with a new CEO appointment, a sequence that usually signals a move from technical proof toward commercial positioning [Bits&Chips, Sep 2025] [Photon Bridge, Jan 2025].
The technical claim is straightforward even if the commercial path is still forming: Photon Bridge combines III-V laser sources with silicon photonics through its cantilever waveguide coupling approach, with the stated aim of simplifying assembly and supporting wafer-scale, higher-volume production [Photon Bridge, retrieved 2026] [PhotonDelta, Apr 2022] [Fibre Systems]. Recent trade coverage gives that claim some external support, including reports of more than 30 mW per color at silicon-chip edge facets in continuous-wave room-temperature operation at wafer scale and a manufacturing partnership with CPFC to validate foundry-scale production [Semiconductor Today, Feb 2026] [Laser Focus World, Mar 2026].
On team, the public record is clearest on the founders and thinner on operating history than investors may want at this stage. Rui Santos and Xaveer Leijtens are identified as co-founders, and Photon Bridge said Paul Marchal became CEO at the 2025 rebrand; independent reporting also confirms Santos continued as CTO, while RocketReach points to Leijtens' background around Eindhoven University of Technology and photonics organizations in the region [Bits&Chips, Sep 2025] [RocketReach, retrieved 2026].
Capital formation is still simple on the evidence available. Photon Bridge announced a €4.75 million seed round in January 2025 led by Innovation Industries, with Faber, BOM, and PhotonDelta participating, which fits a hardware-plus-software company still in technical validation and ecosystem building rather than broad revenue scale [Photon Bridge, Jan 2025]. There is also an unresolved reporting discrepancy around a later €10 million seed figure mentioned in secondary research, so investors should treat the January 2025 announcement as the cleanest confirmed financing datapoint for now [Bits&Chips, Sep 2025].
Over the next 12 to 18 months, the key watch items are customer qualification, evidence that partnerships with PHIX and CPFC convert manufacturability claims into repeatable product output, and any public proof that the company can move from lab performance to named design wins in AI interconnects or adjacent photonics markets [Compound Semiconductor News] [OFC, Mar 2026] [Semiconductor Today, Feb 2026]. The setup is interesting because Photon Bridge is targeting a real bottleneck in optical connectivity, but the investability question still turns less on concept risk than on production evidence, customer adoption, and cleaner verification of commercial traction.
No independent source found -- This section mixes company materials with limited independent trade coverage; several core product and team claims remain company-sourced or only partially corroborated.
Taxonomy Snapshot
| Axis | Value |
|---|---|
| Stage | Seed |
| Business Model | Hardware + Software |
| Industry / Vertical | Deeptech |
| Technology Type | Hardware |
| Geography | Western Europe |
| Growth Profile | Venture Scale |
| Founding Team | Co-Founders (2) |
| Funding | Seed, total disclosed about $4,750,000 |
Company Overview
PUBLIC
Photon Bridge presents as a focused Eindhoven photonics company rather than a broad "AI infrastructure" claim. Public company materials describe the business as developing multi-wavelength digital light engines and high-power laser sources on silicon for computing, networking, and sensing applications, with a stated emphasis on DWDM optical interconnects for AI data centers and high-performance computing [Photon Bridge, retrieved 2026]. The company was founded in 2020 and is headquartered in Eindhoven, Netherlands, according to its website and January 2025 financing announcement [Photon Bridge, retrieved 2026] [Photon Bridge, Jan 2025].
The public milestone record is still short, but it is coherent. PhotonDelta profiled the business in April 2022 under its earlier identity, Photon IP, describing a modular photonic-chip manufacturing approach aimed at separating active and passive components to simplify production [PhotonDelta, Apr 2022]. In January 2025, the company announced a €4.75 million seed round led by Innovation Industries with participation from Faber, BOM, and PhotonDelta [Photon Bridge, Jan 2025]. By September 2025, Bits&Chips reported the rebrand from Photon IP to Photon Bridge and the appointment of Paul Marchal as CEO, while Rui Santos continued as CTO [Bits&Chips, Sep 2025].
That chronology matters because the company is moving from technical positioning toward industrial validation. In February 2026, trade coverage reported wafer-scale laser output of more than 30 mW per color at room temperature [Semiconductor Today, Feb 2026]. In March and April 2026, Photon Bridge disclosed partnerships with the Canadian Photonics Fabrication Centre and PHIX around foundry access, packaging, and external laser-source development, which is the clearest public sign so far that the company is trying to translate platform claims into manufacturable optical subassemblies [OFC, Mar 2026] [Compound Semiconductor News, retrieved 2026].
One source, partially checked -- Confirmed in part by Photon Bridge materials, PhotonDelta, and Bits&Chips; legal entity details were not established in the provided public sources.
The Product and the Stack
Public record plus analysis
Photon Bridge is selling a packaging and light-source integration layer for optical interconnects, not a broad photonics platform in the abstract. Public company materials describe the product as multi-wavelength digital light engines and external laser sources for DWDM optical interconnects, with particular emphasis on AI data centers, high-performance computing, co-packaged optics, and dense optical links [Photon Bridge, retrieved 2026] [Photon Bridge, retrieved 2026] [Compound Semiconductor News] [OFC, Mar 2026]. The recurring technical claim across company and trade-press coverage is a cantilever waveguide coupling approach that joins III-V laser performance with silicon photonics manufacturing scale, with the practical goal of attaching high-power laser sources onto silicon while keeping the assembly flow compatible with wafer-scale production [Photon Bridge, retrieved 2026] [Semiconductor Today, Sep 2025] [Semiconductor Today, Oct 2025] [ECOC].
The part that matters operationally is manufacturability, because that is where many photonics programs slow down. Photon Bridge says its architecture separates active and passive components and uses established III-V and 200 mm silicon photonics foundries, a design choice the company and sector outlets frame as a way to simplify integration and lower production cost if volume demand materializes [PhotonDelta, Apr 2022] [Fibre Systems]. The external validation here is still early but tangible: in February 2026, trade coverage reported wafer-scale demonstration of more than 30 mW per color, or 30 mW per channel, at the silicon-chip edge facets in continuous-wave room-temperature operation, and subsequent announcements tied Photon Bridge to PHIX on advanced packaging and to CPFC on InP laser foundry manufacturing for multi-wavelength external laser sources [Semiconductor Today, Feb 2026] [Fibre Systems] [Laser Focus World, Mar 2026] [Electronics Weekly, Mar 2026].
A few boundaries are worth keeping explicit. The public record supports product intent, named manufacturing partners, and one reported performance marker, but it does not yet establish broad commercial deployment, field reliability data, or customer qualification outcomes in hyperscale environments [Semiconductor Today, Feb 2026] [Photon Bridge, retrieved 2026]. Open roles for a Packaging Engineer and Process Integration Engineer are directionally consistent with a product stack centered on photonic assembly and manufacturing engineering, but any deeper read on internal tooling or process flow would be an inference from hiring rather than a disclosed architecture detail [Photon Bridge, retrieved 2026].
One source, partially checked -- Based on company materials and partially corroborated by trade publications including Semiconductor Today, Fibre Systems, Laser Focus World, and OFC.
The Market They Are Entering
PUBLIC The market matters now because the bottleneck in AI infrastructure is moving from compute alone to the links between chips, boards, and racks, and that shift makes optical interconnect components strategically more important even when company-specific revenue remains unproven [Photon Bridge, retrieved 2026] [Compound Semiconductor News] [Laser Focus World, Mar 2026].
Photon Bridge is positioning into a slice of the photonics stack that sits between silicon photonics, laser manufacturing, and data-center interconnects, but the available source set does not provide a named third-party TAM, SAM, or SOM for the company itself. The public evidence is narrower and more useful: the company and trade press consistently frame the target use cases as DWDM optical interconnects, co-packaged optics, high-density optical links, and AI data-center connectivity rather than broad telecom optics or general semiconductors [Photon Bridge, retrieved 2026] [Compound Semiconductor News] [Laser Focus World, Mar 2026]. That matters because the addressable market should be read as a component and subsystem opportunity inside next-generation optical networking, not as a claim on total AI infrastructure spend.
Where sizing is concerned, the cleanest approach is to stay with analogous market descriptions rather than force a bottom-up estimate without source support. The cited material repeatedly anchors Photon Bridge to AI data centers and high-performance computing, and to manufacturing relationships intended for external laser sources and optical sub-assemblies [Photon Bridge, Jan 2025] [Fibre Systems] [OFC, Mar 2026]. In practical terms, that places the company closer to the optical-engine and laser-source layer than to transceiver vendors as a whole, with demand likely gated by customer qualification cycles and packaging readiness rather than by headline AI capex alone [Semiconductor Today, Feb 2026] [Laser Focus World, Mar 2026].
Cited market-positioning signals
| Market signal | What the sources support | Source |
|---|---|---|
| Primary end market | AI data centers and high-performance computing | [Photon Bridge, Jan 2025] |
| Network architecture focus | DWDM optical interconnects and high-density optical links | [Compound Semiconductor News] [Laser Focus World, Mar 2026] |
| Product insertion point | External laser sources and TOSA-related optical engines | [OFC, Mar 2026] [Compound Semiconductor News] |
| Adjacent markets | Telecom, lidar, and sensing applications are mentioned alongside computing | [Photon Bridge, retrieved 2026] [PhotonDelta, Apr 2022] |
The table does not size the market, but it does sharpen the relevant lens: Photon Bridge appears to be pursuing a focused photonics-enablement market inside data-center optics, with adjacent optionality in telecom and sensing if the platform proves manufacturable across formats.
Demand drivers are easier to support than market size. First, the sources point to higher optical-density requirements in AI data centers, especially around co-packaged optics and high-density interconnects, which is exactly where Photon Bridge and PHIX say they are working together [Compound Semiconductor News] [Laser Focus World, Mar 2026]. Second, manufacturability is a recurring theme across independent trade coverage, with CPFC framed as a foundry partner for multi-wavelength external laser sources and Fibre Systems describing the platform as built on established III-V and 200 mm silicon photonics foundries [OFC, Mar 2026] [Fibre Systems]. Third, the technical result that Photon Bridge reported, more than 30 mW per color or per channel at wafer scale depending on the publication wording, suggests the company is trying to clear a real adoption hurdle: sufficient optical power from a process that can be industrialized rather than a lab-only coupling result [Semiconductor Today, Feb 2026] [Fibre Systems].
Adjacent and substitute markets also shape the opportunity. On the adjacent side, the company website and PhotonDelta describe applications beyond compute, including telecom and sensing, which could widen the reachable market if the same integration method transfers cleanly across architectures [Photon Bridge, retrieved 2026] [PhotonDelta, Apr 2022]. On the substitute side, buyers can source performance improvements from other parts of the optical stack, including alternative laser architectures, packaging methods, or system-level designs that reduce dependence on Photon Bridge's approach. The public record does not name direct competitors, so the conservative read is that market adoption depends less on category creation than on proving this specific integration route is cheaper, scalable, and qualification-ready within existing supply chains [Semiconductor Today, Sep 2025] [Fibre Systems].
Macro and regulatory forces are present, though the evidence is indirect. The positive force is a broad industrial push toward energy-efficient, higher-bandwidth connectivity for AI and communications, language that appears in the company's own materials and is consistent with the trade-press framing around hyperscale optical interconnect demand [Photon Bridge, retrieved 2026] [Compound Semiconductor News]. The limiting force is that photonics supply chains remain manufacturing-intensive and cross-border by definition, spanning InP laser fabrication, silicon photonics, and advanced packaging, so execution will be exposed to foundry capacity, qualification lead times, and industrial policy shifts even without any cited regulation aimed specifically at Photon Bridge [OFC, Mar 2026] [Laser Focus World, Mar 2026]. For investors, that means the market tailwind is credible, but timing will likely be set by ecosystem readiness rather than by demand narratives alone.
One source, partially checked -- Market framing is supported by company materials and trade publications, but no named third-party TAM, SAM, or SOM figures were available in the cited public sources.
The Competitive Field
MIXED Photon Bridge is positioned less as a full-stack optical module vendor and more as a specialized integration layer for bringing high-power, multi-wavelength laser sources onto silicon photonics platforms aimed at DWDM interconnects for AI data centers and high-performance computing [Photon Bridge, retrieved 2026] [Semiconductor Today, Sep 2025] [Fibre Systems].
The competitive map is easier to describe by stack layer than by a clean list of startup rivals, because the available public record names partners but does not name direct competitors [Photon Bridge, retrieved 2026]. At the incumbent end are established optical component and module suppliers that already sell into telecom and data-center interconnect markets, including the tunable-laser and external-laser-source segments Photon Bridge is targeting through its ITLA and DWDM external laser-source work [Photon Bridge, retrieved 2026]. Adjacent substitutes sit one layer over or under the company: silicon photonics platforms that source lasers through conventional packaging approaches, and packaging or foundry partners such as PHIX and CPFC that enable the stack but do not appear, from the public evidence, to own Photon Bridge's specific cantilever waveguide integration claim [Laser Focus World, Mar 2026] [OFC, Mar 2026]. The practical implication is that Photon Bridge competes partly against existing suppliers and partly against the status quo manufacturing flow inside customer programs.
The clearest edge today is technical positioning tied to manufacturability, not distribution [PUBLIC]. Across trade press and company materials, the same theme recurs: heterogeneous integration of III-V laser sources with silicon photonics, done in a way that supports wafer-scale integration and established foundry workflows [Semiconductor Today, Sep 2025] [Semiconductor Today, Oct 2025] [Fibre Systems] [Photon Bridge, retrieved 2026]. That matters because AI interconnect demand is pulling optical performance requirements upward while customers remain sensitive to assembly complexity and yield. The February 2026 demonstration of more than 30 mW per color at the silicon-chip edge facet in continuous-wave room-temperature operation is an early but concrete signal that the platform can hit a performance threshold relevant to the intended use case [Semiconductor Today, Feb 2026]. The edge looks perishable, though, if it does not convert into qualifications and design-ins. Public evidence does not yet show a broad installed base, named hyperscale deployment, or a proprietary channel that would make the company hard to route around [Photon Bridge, retrieved 2026].
Exposure is also fairly clear. Photon Bridge does not appear to control the foundry layer, the advanced packaging layer, or the end-module customer relationship on its own public evidence, which means execution depends on partners remaining aligned as the product matures [Laser Focus World, Mar 2026] [Compound Semiconductor News] [OFC, Mar 2026]. A larger incumbent with an in-house laser supply chain or an existing qualification footprint at major optical buyers could hold an advantage on time-to-revenue even if Photon Bridge's integration architecture is elegant. There is also a category boundary here: the company is discussed publicly in external laser sources, DWDM optical engines, and co-packaged-optics-adjacent assemblies, but the sources do not establish that it competes across the full transceiver, switch, or networking-system stack [Photon Bridge, retrieved 2026] [Compound Semiconductor News]. That narrows the beachhead and raises the importance of winning a small number of integration points.
Over the next 18 months, the most plausible competitive scenario is not a winner-take-all outcome but a sorting process based on qualification speed and manufacturability. Photon Bridge is the likely winner if customer qualification confirms that its cantilever waveguide approach can preserve optical power while fitting commercial foundry and packaging flows at volume [Semiconductor Today, Feb 2026] [Fibre Systems] [Laser Focus World, Mar 2026]. Photon Bridge is also the most obvious loser if large customers decide that incremental improvements to conventional laser attachment and packaging are good enough, because that would favor incumbent supply chains over a newer integration architecture [Photon Bridge, retrieved 2026].
Opportunity
PUBLIC
The prize here is not a niche component win but a credible shot at becoming a key enabling layer for the optical engines that move data inside AI data centers, if Photon Bridge can turn its lab-level performance and foundry partnerships into repeatable volume production [Photon Bridge, retrieved 2026] [Semiconductor Today, Feb 2026] [Laser Focus World, Mar 2026].
The headline opportunity is straightforward. Photon Bridge is trying to sit at a pressure point in advanced compute infrastructure: high-power, multi-wavelength laser sources that can be attached to silicon photonics for DWDM optical interconnects in AI data centers and high-performance computing [Photon Bridge, retrieved 2026] [Semiconductor Today, Sep 2025] [Fibre Systems]. That outcome becomes reachable, rather than purely aspirational, because the company has moved beyond concept language into externally covered technical milestones, including more than 30 mW per color at silicon-chip edge facets in continuous-wave operation at room temperature at wafer scale, and because it has named manufacturing and packaging partners in CPFC and PHIX that map directly to the hard part of this category, which is industrialization rather than architectural storytelling [Semiconductor Today, Feb 2026] [OFC, Mar 2026] [Compound Semiconductor News].
There are a few distinct ways that upside could unfold. The common thread is that each route depends less on consumer-style brand building and more on becoming a preferred building block inside a stack that already has urgent demand from AI infrastructure buyers.
| Scenario | What happens | Catalyst | Why it's plausible |
|---|---|---|---|
| DWDM engine supplier for AI interconnects | Photon Bridge becomes a preferred external laser-source provider for DWDM links used in AI data center and HPC optical interconnects | The PHIX collaboration advances its DWDM external laser-source TOSA for co-packaged optics and high-density interconnects, creating a packaging path toward customer programs [Compound Semiconductor News] | The company is already positioning around AI data centers and has public evidence of both wafer-scale output and packaging collaboration, which are relevant prerequisites for supplier qualification [Photon Bridge, retrieved 2026] [Semiconductor Today, Feb 2026] [Laser Focus World, retrieved 2026] |
| Foundry-linked integration platform | Photon Bridge becomes the preferred heterogeneous integration layer connecting III-V laser sources with silicon photonics designs made in established foundries | The CPFC partnership validates manufacturability in a commercial-scale InP photonics foundry and provides a foundry-side route into broader customer engagement [OFC, Mar 2026] [Electronics Weekly, Mar 2026] | Trade coverage repeatedly describes the platform as using established III-V and 200 mm silicon photonics foundries, which supports a scale path that does not require the company to vertically build every manufacturing step itself [Fibre Systems] [Semiconductor Today, Mar 2026] |
| Tunable-laser platform entry point | Photon Bridge turns one announced partner adoption into a broader tunable-laser module business spanning telecom and data-center applications | The company said OE Solutions was its lead partner for integrated tunable laser assembly modules, described as first customer adoption of the tunable-laser integration platform [Photon Bridge, retrieved 2026] | A first named adoption does not prove repeatability, but it does suggest the technology can be embedded in a commercial partner roadmap rather than remaining a lab demonstrator [Photon Bridge, retrieved 2026] [Bits&Chips, Sep 2025] |
The compounding mechanism, if it appears, would come from process credibility. A photonics supplier that shows manufacturable wafer-scale output, works with known foundry and packaging partners, and lands one or two design-ins can make the next qualification cycle easier because customers in this market tend to value supply-chain readiness and packaging compatibility as much as device performance [Semiconductor Today, Feb 2026] [Laser Focus World, Mar 2026] [Fibre Systems]. Photon Bridge's public narrative already points in that direction: the platform is described as modular and de-integrated, separating active and passive components, and trade coverage ties that architecture to use of established III-V and silicon photonics foundries [PhotonDelta, Apr 2022] [Fibre Systems]. If that model works in practice, each additional partner could improve manufacturability, lower integration friction, and widen the set of customers willing to evaluate the platform.
The size of the win is hard to pin down from public evidence because no credible market-sizing figure is confirmed in the record provided here. Even so, the relevant benchmark is not a small specialty-components outcome. If Photon Bridge becomes an embedded supplier in AI-oriented optical interconnects, the strategic value could resemble the kind of photonics infrastructure asset that attracts either premium private financing or acquisition interest from larger optical, semiconductor, or networking incumbents seeking control over the laser-source layer (scenario, not a forecast) [Photon Bridge, retrieved 2026] [Compound Semiconductor News] [OFC, Mar 2026]. Public materials support the argument that this is a platform ambition tied to a large infrastructure shift, but they do not yet support a tighter valuation range without introducing unsupported comparables.
Thinly sourced -- This section relies on a mix of company materials and single-source trade coverage for technical progress, partnerships, and scenario plausibility; no independently confirmed market-size or valuation comparable is available in the supplied sources.
Sources
Publicly reported
[Photon Bridge, retrieved 2026] Redefining Photonics Integration | https://www.photonbridge.com/
[Semiconductor Today, Feb 2026] Photon Bridge demos >30mW laser output per color at wafer scale | https://www.semiconductor-today.com/news_items/2026/feb/photon-bridge-120226.shtml
[Bits&Chips, Sep 2025] Photon Bridge rebrands and taps new CEO | https://bits-chips.com/article/photon-bridge-rebrands-and-taps-new-ceo/
[Photon Bridge, Jan 2025] PHOTON IP raises €4.75M seed funding led by Innovation Industries, with Faber, BOM and PhotonDelta | https://www.photonbridge.com/news/photon-ip-raises-%E2%82%AC4.75m-seed-funding-led-by-innovation-industries,-with-faber,-bom-and-photondelta
[PhotonDelta, Apr 2022] Photon Bridge’s Modular Approach Aims to Simplify and Scale Photonic Chip Manufacturing | https://www.photondelta.com/news/photon-bridge-modular-photonic-chip-manufacturing/
[Fibre Systems] Photon Bridge demonstrates 30 mW per channel laser output at wafer scale | https://www.fibre-systems.com/news/photon-bridge-demonstrates-30-mw-channel-laser-output-wafer-scale
[Laser Focus World, Mar 2026] Photon Bridge and CPFC partner to validate path to scalable multi-wavelength light engines | https://www.laserfocusworld.com/lasers-sources/article/55277096/photon-bridge-and-cpfc-partner-to-validate-path-to-scalable-multi-wavelength-light-engines
[RocketReach, retrieved 2026] Rui Santos Chief Executive Officer and Co-Founder at Photonip | https://rocketreach.co/rui-santos-email_35148824
[Compound Semiconductor News] Photon Bridge and PHIX advance DWDM external laser sources for AI data centers | https://compoundsemiconductor.net/article/121025/Photon_Bridge_and_PHIX_advance_DWDM_external_laser_sources_for_AI_data_centers
[OFC, Mar 2026] Photon Bridge and CPFC announce strategic partnership for scalable multi-wavelength external laser sources | https://www.ofcconference.org/en-us/home/exhibitors/exhibitor-press-releases/2026/photon-bridge-and-cpfc-announce-strategic-part/
[Semiconductor Today, Sep 2025] Photon IP becomes Photon Bridge and appoints Paul Marchal as CEO | https://www.semiconductor-today.com/news_items/2025/sep/photon-bridge-250925.shtml
[Semiconductor Today, Oct 2025] Photon Bridge launches integrated photonics platform for AI and communications | https://www.semiconductor-today.com/news_items/2025/oct/photon-bridge-161025.shtml
[ECOC, retrieved 2026] Photon Bridge at ECOC Exhibition | https://www.ecoc2025.org/exhibition/exhibitors/photon-bridge/
[Electronics Weekly, Mar 2026] Photon Bridge teams with Canadian Photonics Fabrication Centre | https://www.electronicsweekly.com/news/business/photon-bridge-teams-canadian-photonics-fabrication-centre-2026-03/
[Laser Focus World, retrieved 2026] Photon Bridge and PHIX accelerate DWDM external laser sources for hyperscale AI data centers | https://www.laserfocusworld.com/optics/article/55284356/photon-bridge-and-phix-accelerate-dwdm-external-laser-sources-for-hyperscale-ai-data-centers
Articles about Photon Bridge
- Photon Bridge’s Wafer-Scale Lasers Target the AI Data Center Bottleneck — The Eindhoven startup’s modular approach to integrating high-power lasers with silicon photonics aims to simplify manufacturing for co-packaged optics.